AutoForm Assembly R11 – Virtual Optimization of BiW Assembly Processes

AutoForm Assembly R11 facilitates the virtual optimization of BiW assembly processes. The main new features and enhancements developed for the joining process, the assembly process and the dimensional accuracy of the entire BiW are:

• Support of laser line welding: The latest release enables users to consider thermal effects of laser line welding. This newly developed option for the joining process enables them to specify welding speed, power input and efficiency as process parameters in order to calculate the thermal loading of the heat-affected zone. Based on the change of local strains and stresses, users can determine the impact of thermal effects to the dimensional accuracy of the assembly.
• Assembly simulation considering real part geometry: With this release, users can carry out assembly simulations also at the process engineering stage when first produced stampings are already available. The new capability allows them to map simulation results of individual stampings, such as strains, stresses and thickness distribution, to scanned part geometries from production. Such type of mapping more accurately reflects the condition of the produced stampings. This is especially important as an input for the assembly simulation, since the combination of real geometry and physical state of the stamping ensures more accurate simulation results of the assembled parts.
• Better alignment with reality: With enhancements in the latest software version regarding the description of constraints in the assembly and measurement operations, users have better control over the process definition and can achieve more consistent alignment with reality.

Through these and other new features and enhancements, users are optimally equipped for the design of the assembly process starting with early feasibility studies, moving to process engineering and then advancing to tryout and production support.